Thermalright creates an anti-bend solution for Intel’s Alder Lake processors. Intel’s Alder Lake processors are prone to flexing and warping, a flaw with the Intel LGA1700 CPU’s latching system. In response to this problem, an anti-bend frame was developed, designed to prevent warping/bending of Alder Lake CPUs. The LGA1700-BCF, an aluminum frame that replaces the CPU mounting mechanism of the company’s LGA1700 CPU socket. This frame fits around the processor and is secured with simple screws. The frame applies more even pressure to Intel’s Alder Lake processors, reducing the chance of warping. This LGA 1700 Anti-Bend Buckle adopts an all-aluminum CNC gold anodized sandblasting process, with an overall size of 70 x 54 x 6 mm and an overall weight of 55g. Its precise positioning can avoid the capacitors on the motherboard, and uses the original LOTES insulation protection pads, and also provides different color schemes. Compared with the previous home-made brackets, this LGA 1700 anti-bending buckle is much more comprehensive in design and better quality. What’s more, the price is very affordable. Z690, B660 and H610 motherboards can use this LGA 1700 anti-bending clip.