Product Details:

Low Profile – The total height is 13.5mm which reduces the likelihood of interference with other components and provides the best efficiency within a limited space.

Features:

• Multiple push pin locations for universal mounting on various board
  assembly. (hole to hole distance 47.5mm and 53.5m).
• Formed of pure copper for enhanced thermal conductivity.
• Excellent surface flatness minimizes the interface between the heat source and heat sink.

Specifications:

Diagrams: