Product Details:
Enzotech’s first Mosfet product is released, MOS-c1. Like many of Enzotech’s products, the MOS-C1 is designed with forged copper technology for maximum surface contact and exceptional heat dissipation.
ENZOTECH MOS-C1 heatsinks were designed to offer exceptional heat dissipation for integrated MOSFET motherboards and video cards. MOS-C1 heatsinks are made using a forged copper process which produces a dense material that is extremely efficient at heat extraction. The MOS-C1 heatsink is far superior to traditional heat sinks currently found on the market and it provides the best thermal conductivity available to dissipate heat from the MOSFET in your system.
| Dimensions (mm) |
6.5(L) mm x6.5mm(W) x12mm(H) |
| Material |
C1100 Forged Copper |
| Weight |
2g (Each) |
| Thermal Adhesive |
3M 8815 Thermal Tape (Datasheet) |
Features:
- Compatible with all the Motherboards
- Pure forged copper
- Easy installation by using 3M 8815 Thermal Tape
- Multipack – Ten (10) piece set
Specifications:
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